Assignment of Assignor's Interest

Recorded: 1999-08-18 Pages: 3

Assignors

TAKAHASHI, KAZUHIRO

Executed: 1999-07-08

EBE, KAZUYOSHI

Executed: 1999-07-08

TAKYU, SHINYA

Executed: 1999-07-08

Assignees

LINTEC CORPORATION

23-23, HONCHO, ITABASHI-KU, TOKYO 173-0001, JAPAN

KABUSHIKI KAISHA TOSHIBA

72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI, KANAGAWA 210-8572, JAPAN

Covered Property (1)

Method for Grinding a Wafer Back

Patent: 6,465,330 →

Application: 09/387,705 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.