IP Library › Assignment 043727/0167
Patent Assignment
Reel/Frame 043727/0167

Assignment of Assignor's Interest

Recorded: 2017-09-28 Pages: 4
Assignor
KABUSHIKI KAISHA TOSHIBA
Executed: 2017-09-05
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties (35)
Wafer Transfer Apparatus
Patent: 6,238,515 →
Application: 09/376,996 →
Method for Grinding a Wafer Back
Patent: 6,465,330 →
Application: 09/387,705 →
Polishing Slurry and Polishing Method
Patent: 6,338,744 →
Application: 09/481,573 →
Water-Laden Solid Matter of Vapor-Phase Processed Inorganic Oxide Particles and Slurry for Polishing and Manufacturing Method of Semiconductor Devices
Patent: 6,409,780 →
Application: 09/482,937 →
Composite Particles and Production Process Thereof, Aqueous Dispersion, Aqueous Dispersion Composition for Chemical Mechanical Polishing, and Process for Manufacture of Semiconductor Device
Patent: 6,454,819 →
Application: 09/484,064 →
Aqueous Dispersion, Aqueous Dispersion for Chemical Mechanical Polishing Used for Manufacture of Semiconductor Devices, Method for Manufacture of Semiconductor Devices, and Method for Formation of Embedded Wiring
Patent: 6,740,590 →
Application: 09/531,163 →
Composition for Film Formation, Method of Film Formation, and Insulating Film
Patent: 6,410,151 →
Application: 09/670,547 →
Aqueous Dispersion for Chemical Mechanical Polishing and Chemical Mechanical Polishing Process
Patent: 6,579,153 →
Application: 09/756,193 →
Publication: US 2001/0008828
Aqueous Dispersion for Chemical Mechanical Polishing Used for Polishing of Copper
Patent: 6,653,267 →
Application: 09/893,961 →
Publication: US 2002/0016275
Slurry for Chemical Mechanical Polishing and Method of Manufacturing Semiconductor Device
Patent: 6,924,227 →
Application: 09/932,943 →
Publication: US 2002/0023389
Method of Forming Coating Film, Method of Manufacturing Semiconductor Device and Coating Solution
Patent: 6,645,881 →
Application: 10/112,951 →
Publication: US 2003/0139063
Plasma Processing Method
Patent: 6,642,149 →
Application: 10/286,789 →
Publication: US 2003/0054647
Plasma Treatment Apparatus
Patent: 7,186,315 →
Application: 10/402,950 →
Publication: US 2004/0020431
Method and Device for Plasma-Etching Organic Material Film
Patent: 7,419,613 →
Application: 10/538,064 →
Publication: US 2006/0213865
Aqueous Dispersion for Chemical Mechanical Polishing
Patent: 7,087,530 →
Application: 10/689,680 →
Publication: US 2004/0144755
Aqueous Dispersion for Chemical Mechanical Polishing, Chemical Mechanical Polishing Process, Production Process of Semiconductor Device and Material for Preparing an Aqueous Dispersion for Chemical Mechanical Polishing
Patent: 7,005,382 →
Application: 10/694,890 →
Publication: US 2004/0132305
Vacuum Processing Apparatus and Substrate Transfer Method
Patent: 6,990,747 →
Application: 10/821,971 →
Publication: US 2004/0255485
Plasma Processing Apparatus
Patent: 7,368,876 →
Application: 10/854,142 →
Publication: US 2005/0011452
Chemical Mechanical Polishing Aqueous Dispersion and Chemical Mechanical Polishing Method
Patent: 6,935,928 →
Application: 10/882,362 →
Publication: US 2005/0037693
Etching Method
Patent: 7,285,498 →
Application: 10/956,365 →
Publication: US 2005/0085077
Plasma Etching Method
Patent: 7,749,914 →
Application: 10/960,538 →
Publication: US 2005/0082256
Peeling Device and Peeling Method
Patent: 7,172,673 →
Application: 11/038,479 →
Publication: US 2005/0205204
Processing Method for Conservation of Processing Gases
Patent: 7,628,931 →
Application: 11/197,434 →
Publication: US 2005/0279731
Film Forming System and Film Forming Method
Patent: 7,935,185 →
Application: 11/229,841 →
Publication: US 2006/0081181
Vacuum Processing Apparatus and Substrate Transfer Method
Patent: 7,201,851 →
Application: 11/259,147 →
Publication: US 2006/0032074
Capacitive Coupling Plasma Processing Apparatus
Patent: 7,767,055 →
Application: 11/292,353 →
Publication: US 2006/0118044
Substrate Plasma Processing Apparatus and Plasma Processing Method
Patent: 8,821,684 →
Application: 12/363,070 →
Publication: US 2009/0194508
Chemical Mechanical Polishing Method and Method of Manufacturing Semiconductor Device
Patent: 8,119,517 →
Application: 12/477,332 →
Publication: US 2009/0239373
Chemical Mechanical Polishing Aqueous Dispersion and Chemical Mechanical Polishing Method
Patent: 8,492,276 →
Application: 12/537,766 →
Publication: US 2010/0075501
Plasma Etching Unit
Patent: 8,840,753 →
Application: 12/578,007 →
Publication: US 2010/0024983
Surface Treatment Composition, Surface Treatment Method, and Method for Manufacturing Semiconductor Device
Patent: 8,257,504 →
Application: 12/794,028 →
Publication: US 2010/0311630
Plasma Processing Method and Manufacturing Method of Semiconductor Device
Patent: 9,177,781 →
Application: 13/178,759 →
Publication: US 2012/0009786
Supercritical Drying Method and Apparatus for Semiconductor Substrates
Patent: 8,372,212 →
Application: 13/369,970 →
Publication: US 2012/0247516
Supercritical Drying Method for Semiconductor Substrate and Supercritical Drying Apparatus
Patent: 8,771,429 →
Application: 13/420,870 →
Publication: US 2013/0019905
Deposit Removal Method
Patent: 9,177,816 →
Application: 14/222,762 →
Publication: US 2014/0206198
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 18, 1999
From: TSUJIMOTO, MASAKI; KOBAYASHI, KENJI; NUMATA, HIDEO; TOKUBUCHI, KEISUKE
To: LINTEC CORPORATION; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 010190/0818 →
Assignment of Assignor's Interest Aug 18, 1999
From: TAKAHASHI, KAZUHIRO; EBE, KAZUYOSHI; TAKYU, SHINYA
To: LINTEC CORPORATION; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 010227/0920 →
Assignment of Assignor's Interest Jan 11, 2000
From: TATEYAMA, YOSHIKUNI; YAMAMOTO, KATSUMI; KATO, HIROSHI; HAYASHI, KAZUHIKO
To: TOKUYAMA CORPORATION; TOSHIBA CORPORATION
Reel/Frame 010519/0309 →
Assignment of Assignor's Interest Apr 7, 2000
From: YANO, HIROYUKI; MINAMIHABA, GAKU; MATSUI, YUKITERU; OKUMURA, KATSUYA
To: KABUSHIKI KAISHA TOSHIBA; JSR CORPORATION
Reel/Frame 010726/0957 →
Assignment of Assignor's Interest May 3, 2000
From: YANO, HIROYUKI; HAYASAKA, NOBUO; OKUMURA, KATSUYA; IIO, AKIRA
To: KABUSHIKI KAISHA TOSHIBA; JSR CORPORATION
Reel/Frame 010790/0119 →
Assignment of Assignor's Interest Jun 21, 2000
From: YANO, HIROYUKI; MINAMIHABA, GAKU; MATSUI, YUKITERU; OKUMURA, KATSUYA
To: KABUSHIKI KAISHA TOSHIBA; JSR CORPORATION
Reel/Frame 010925/0545 →
Assignment of Assignor's Interest Dec 13, 2000
From: KUROSAWA, TAKAHIKO; HAYASHI, EIJI; YOUNGSOON, SEO; SHIOTA, ATSUSHI
To: JSR CORPORATION
Reel/Frame 011365/0825 →
Assignment of Assignor's Interest Apr 9, 2001
From: UCHIKURA, KAZUHITO; MOTONARI, MASAYUKI; HATTORI, MASAYUKI; KAWAHASHI, NOBUO
To: JSR CORPORATION
Reel/Frame 011677/0365 →
Assignment of Assignor's Interest Sep 28, 2001
From: YANO, HIROYUKI; MINAMIHABA, GAKU; MOTONARI, MASAYUKI; HATTORI, MASAYUKI
To: KABUSHIKI KAISHA TOSHIBA; JSR CORPORATION
Reel/Frame 012212/0878 →
Assignment of Assignor's Interest Nov 2, 2001
From: MINAMIHABA, GAKU; YANO, HIROYUKI; KURASHIMA, NOBUYUKI; KAWAHASHI, NOBUO
To: KABUSHIKI KAISHA TOSHIBA; JSR CORPORATION
Reel/Frame 012294/0407 →
Assignment of Assignor's Interest Mar 20, 2002
From: JSR CORPORATION
To: KABUSHIKI KAISHA TOSHIBA (50%)
Reel/Frame 012699/0876 →
Assignment of Assignor's Interest Jun 26, 2002
From: YAMADA, NOBUHIDE; NAKATA, REMPEI; SUGIURA, MAKOTO; YOSHIOKA, MUTSUHIKO
To: KABUSHIKI KAISHA TOSHIBA; JSR CORPORATION
Reel/Frame 013033/0205 →
Assignment of Assignor's Interest Mar 18, 2003
From: JSR CORPORATION
To: KABUSHIKI KAISHA TOSHIBA (50%)
Reel/Frame 013857/0679 →
Assignment of Assignor's Interest Sep 12, 2003
From: HIMORI, SHINJI; SAKAI, ITSUKO
To: TOKYO ELECTRON LIMITED; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 014487/0063 →
Assignment of Assignor's Interest Mar 24, 2004
From: NISHIMOTO, KAZUO; SAKANO, TATSUAKI; TAKEMURA, AKIHIRO; HATTORI, MASAYUKI
To: JSR CORPORATION; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 015133/0973 →
Assignment of Assignor's Interest Aug 23, 2004
From: KITOKU, TOSHIHIKO; NIWA, SHINJI; HOSAKA, TOSHIKI; KITAZAWA, TAKASHI
To: TOKYO ELECTRON LIMITED; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 015736/0888 →
Assignment of Assignor's Interest Sep 27, 2004
From: HAYAMI, TOSHIHIRO; ITO, ETSUJI; SAKAI, ITSUKO
To: TOKYO ELECTRON LIMITED
Reel/Frame 015835/0289 →
Assignment of Assignor's Interest Oct 29, 2004
From: UCHIKURA, KAZUHITO; NISHIMOTO, KAZUO; HATTORI, MASAYUKI; KAWAHASHI, NOBUO
To: JSR CORPORATION; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 015938/0431 →
Assignment of Assignor's Interest Mar 7, 2006
From: HONDA, MASANOBU; MATSUYAMA, SHOICHIRO; NAGASEKI, KAZUYA; HAYASHI, HISATAKA
To: TOKYO ELECTRON LIMITED; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 017958/0933 →
Substitute Assignment Dec 4, 2006
From: HAYAMI, TOSHIHIRO; ITO, ETSUJI; SAKAI, ITSUKO
To: TOKYO ELECTRON LIMITED; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 018589/0356 →
Merger Jan 20, 2022
From: TOSHIBA MEMORY CORPORATION
To: K.K.PANGEA
Reel/Frame 058788/0338 →
Assignment of Assignor's Interest Feb 1, 2022
From: K.K.PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058922/0308 →
Change of Name Feb 11, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 059039/0123 →
Change of Name Apr 6, 2022
From: K.K.PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 059619/0200 →
Change of Name Apr 7, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 059649/0647 →