IP Library Assignment 010496/0001
Patent Assignment
Reel/Frame 010496/0001

Assignment of Assignor's Interest

Recorded: 1999-12-29 Pages: 3
Assignors
DUBIN, ISRAEL
Executed: 1999-11-15
ERWIN, CHARLES M.
Executed: 1999-11-29
Assignee
RADISYS CORPORATION
5445 NE DAWSON CREEK DRIVE, HILLSBORO, OREGON, 97124
Covered Property (1)
Method and Apparatus for Heat Dispersion from the Bottom Side of Integrated Circuit Packages on Printed Circuit Boards
Patent: 6,349,033 →
Application: 09/474,721 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jan 3, 2018
From: RADISYS CORPORATION; RADISYS INTERNATIONAL LLC
To: HCP-FVG, LLC
Reel/Frame 044995/0671 →
Security Interest Jan 4, 2018
From: RADISYS CORPORATION
To: MARQUETTE BUSINESS CREDIT, LLC
Reel/Frame 044540/0080 →