Patent Assignment
Reel/Frame 010670/0209
Assignment of Assignor's Interest
Recorded: 2000-03-08
Pages: 2
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device Having a Chip, Reinforcing Plate, and Sealing Material Sharing a Common Rear Surface
Patent:
6,459,152 →
Application:
09/521,468 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.