Patent Assignment
Reel/Frame 024055/0581
Assignment of Assignor's Interest
Recorded: 2010-03-10
Pages: 3
Assignor
MITSUBISHI DENKI KABUSHIKI KAISHA
Executed: 2010-02-23
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Properties
(11)
Data Output Circuit with Reduced Output Noise
Patent:
5,701,090 →
Application:
08/559,746 →
Semiconductor Device Comprising Capacitor and Method of Fabricating the Same
Patent:
6,194,758 →
Application:
09/095,612 →
Data Output Circuit with Reduced Output Noise
Patent:
6,163,180 →
Application:
09/298,968 →
Semiconductor Device Having a Chip, Reinforcing Plate, and Sealing Material Sharing a Common Rear Surface
Patent:
6,459,152 →
Application:
09/521,468 →
Semiconductor Device and Method of Producing the Same
Patent:
6,521,969 →
Application:
09/685,896 →
Data Output Circuit with Reduced Output Noise
Patent:
6,445,222 →
Application:
09/708,509 →
Semiconductor Integrated Circuit Device Operating with Low Power Consumption
Thin Film Magnetic Memory Device Having a Highly Integrated Memory Array
Thin film magnetic memory device including memory cells having a magnetic tunnel junction
Patent:
6,349,054 →
Application:
09/852,087 →
Semiconductor Memory
Data Output Circuit with Reduced Output Noise
Patent:
38,213 →
Application:
09/920,624 →
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 5, 1996
From: HIDAKA, HIDETO; HIROSE, MASAKAZU
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 007832/0952 →
Assignment of Assignor's Interest
Jun 11, 1998
From: TANAKA, YOSHINORI; SHIMIZU, MASAHIRO; ARIMA, HIDEAKI
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 009253/0407 →
Assignment of Assignor's Interest
Mar 8, 2000
From: TOMITA, YOSHIHIRO; BABA, SHINJI
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 010670/0209 →
Assignment of Assignor's Interest
Oct 11, 2000
From: TOMITA, KAZUO
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 013731/0993 →
Assignment of Assignor's Interest
Feb 6, 2001
From: HIDAKA, HIDETO
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 011579/0629 →
Assignment of Assignor's Interest
Apr 11, 2001
From: HIDAKA, HIDETO
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 011732/0933 →
Assignment of Assignor's Interest
May 10, 2001
From: HIDAKA, HIDETO
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 011808/0758 →
Assignment of Assignor's Interest
Oct 9, 2001
From: NII, KOJI
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 012236/0553 →
Change of Name
Mar 8, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025917/0837 →
Assignment of Assignor's Interest
Mar 18, 2011
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025980/0219 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →