Patent Assignment
Reel/Frame 010777/0377
Assignment of Assignor's Interest
Recorded: 2000-04-26
Pages: 3
Assignors
MISHIMA, KOJI
Executed: 2000-02-09
NAGAI, MIZUKI
Executed: 2000-02-09
KIMIZUKA, RYOICHI
Executed: 2000-02-09
MATSUDA, TETSUO
Executed: 2000-02-09
KANEKO, HISASHI
Executed: 2000-02-09
Assignees
EBARA CORPORATION
11-1 HANEDA ASAHI-CHO, OHTA-KU, TOKYO, JAPAN
KABUSHIKI KAISHA TOSHIBA
72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI, KANAGAWA-KEN, JAPAN
Covered Property
(1)
Method and Apparatus for Plating Substrate with Copper
Patent:
6,638,411 →
Application:
09/492,138 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.