Assignment of Assignor's Interest

Recorded: 2000-06-19 Pages: 3

Assignors

SHIBATA, KAZUTAKA

Executed: 2000-06-12

HIKITA, JUNICHI

Executed: 2000-06-08

UEDA, SHIGEYUKI

Executed: 2000-05-24

Assignee

ROHM CO., LTD.

21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO, JAPAN

Covered Property (1)

Method of Forming Through-Holes in a Wafer and Then Dicing to Form Stacked Semiconductor Devices

Patent: 6,391,685 →

Application: 09/511,106 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.