Patent Assignment
Reel/Frame 052273/0877
Assignment of Assignor's Interest
Recorded: 2020-03-31
Pages: 8
Assignor
ROHM CO., LTD.
Executed: 2019-09-27
Assignee
ACHLYS TECHNOLOGIES INC.
1891 ROBERTSON ROAD, SUITE 100, OTTAWA, K2H 5B7, CANADA
Covered Properties
(71)
Semiconductor Device
Patent:
6,396,154 →
Application:
09/493,168 →
Semiconductor device of chip-on-chip structure and semiconductor chip for use therein
Patent:
6,232,668 →
Application:
09/493,250 →
Semiconductor Device and Semiconductor Chip for Use Therein
A Semiconductor Device Having a Chip-on-Chip Structure
Patent:
6,404,060 →
Application:
09/496,191 →
Semiconductor Device and Manufacturing Method Thereof
Patent:
6,404,040 →
Application:
09/497,157 →
Semiconductor Chip and Production Thereof, and Semiconductor Device Having Semiconductor Chip Bonded to Solid Device
Patent:
6,724,084 →
Application:
09/499,384 →
Semiconductor Chip for Chip-on-Chip Structure
Patent:
6,476,499 →
Application:
09/499,579 →
Semiconductor Chip and Semiconductor Device of Chip-on-Chip Structure
Patent:
6,657,309 →
Application:
09/499,580 →
Semiconductor Device
Patent:
6,369,407 →
Application:
09/500,462 →
Semiconductor Chip and Semiconductor Device Having a Chip-on-Chip Structure
Semiconductor Chip
Patent:
6,355,977 →
Application:
09/504,856 →
Method of Forming Through-Holes in a Wafer and Then Dicing to Form Stacked Semiconductor Devices
Patent:
6,391,685 →
Application:
09/511,106 →
Semiconductor Device Having Chip-on-Chip Structure and Semiconductor Chip Used Therefor
Patent:
6,424,049 →
Application:
09/511,107 →
Semiconductor Device Having a Primary Chip with Bumps in Joined Registration with Bumps of a Plurality of Secondary Chips
Patent:
6,717,244 →
Application:
09/511,108 →
Semiconductor Device and Semiconductor Chip
Patent:
6,404,061 →
Application:
09/512,061 →
Semiconductor Device and Semiconductor Chip
Patent:
6,376,915 →
Application:
09/512,337 →
Method of fabricating semiconductor device
Patent:
6,251,797 →
Application:
09/515,670 →
Multichip semiconductor device
Patent:
6,337,579 →
Application:
09/517,283 →
Multi-Layered Integrated Semiconductor Device Incorporating Electrically Connected Integrated Circuit Chips and Monitoring Pads
Production of Semiconductor Device
Patent:
6,376,362 →
Application:
09/546,172 →
Semiconductor integrated circuit device with enhanced protection from electrostatic breakdown
Patent:
6,339,234 →
Application:
09/583,539 →
Semiconductor Chip with External Connecting Terminal
Patent:
6,870,248 →
Application:
09/588,628 →
Semiconductor Device and Method for Manufacturing Thereof
Patent:
6,458,609 →
Application:
09/612,480 →
Semiconductor Chip and Method of Producing the Same
Patent:
6,744,140 →
Application:
09/665,663 →
Semiconductor Device of Chip-on-Chip Structure with a Radiotion Noise Shield
Patent:
6,720,662 →
Application:
09/702,870 →
Method of Producing a Semiconductor Device by Dividing a Semiconductor Wafer into Separate Pieces of Semiconductor Chips
Patent:
6,635,512 →
Application:
09/704,563 →
Semiconductor Device with Warp Preventing Board Joined Thereto
Semiconductor Device and Method for Manufacturing the Same
Patent:
7,129,110 →
Application:
09/830,092 →
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device and Fabrication Process Therefor
Semiconductor Device with Chip-on-Chip Construction Joined via a Low-Melting Point Metal Layer
Semiconductor Chip and Semiconductor Device Using the Same, and Method of Fabricating Semiconductor Chip
Semiconductor Device and Manufacturing Method Thereof
Method of Cutting a Wafer into Individual Chips
Semiconductor Device
Semiconductor Chip, Chip-on-Chip Structure Device, and Assembling Method Thereof
Authentication System Having a Semiconductor Device Containing Data Which Are Difficult to Analyze Through Illegitimate Access, and Semiconductor Device Therefor
Semiconductor Device Having Opposed and Connected Semiconductor Chips with Lateral Deviation Confirming Electrodes
Semiconductor Device
Semiconductor Device and Method for Producing the Same
Semiconductor Device
Semiconductor Device and Method for Manufacturing Same
Semiconductor Device Having a Primary Chip with Bumps in Joined Registration with Bumps of a Plurality of Secondary Chips
Semiconductor Device and Fabrication Process Therefor
Electronic Device, Semiconductor Device Using Same, and Method for Manufacturing Semiconductor Device
Semiconductor Device and Semiconductor Chip for Use Therein
Method of Producing a Semiconductor Device by Dividing a Semiconductor Wafer into Separate Pieces of Semiconductor Chips
Method for Manufacturing Semiconductor Device
Semiconductor Device for Radio Communication Device, and Radio Communication Device Using Said Semiconductor Device
Semiconductor Device and Method for Manufacturing Same
Semiconductor Device
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Chip and Production Thereof, and Semiconductor Device Having Semiconductor Chip Bonded to Solid Device
Semiconductor Chip and Method of Producing the Same
Semiconductor Device Manufactured with Auxillary Mask and Method for Producing the Same
Semiconductor Device with Multi-Staged Cut Side Surfaces
Semiconductor Chip with External Connecting Terminal
Semiconductor Chip with External Connecting Terminal
Semiconductor Chip with External Connecting Terminal
Semiconductor Device and Fabrication Process Therefor
Semiconductor Device and Method for Producing the Same
Semiconductor Device Having a Stacked Chip Structure
Semiconductor Chip and Semiconductor Device
Semiconductor Chip and Method for Manufacturing Same, Electrode Structure of Semiconductor Chip and Method for Forming Same, and Semiconductor Device
Interposer and Semiconductor Device
Semiconductor Chip, Method of Manufacturing Semiconductor Chip, and Semiconductor Device
Semiconductor Device
Semiconductor Chip, Electrode Structure Therefor and Method for Forming Same
Semiconductor Package, Printed Circuit Board Substrate and Semiconductor Device
Semiconductor Package, Printed Circuit Board Substrate and Semiconductor Device
Semiconductor Package, Printed Circuit Board Substrate and Semiconductor Device
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 28, 2000
From: HIKITA, JUNICHI; MOCHIDA, HIROO
To: ROHM CO., LTD.
Reel/Frame 010591/0233 →
Assignment of Assignor's Interest
Jan 28, 2000
From: HIKITA, JUNICHI; MOCHIDA, HIROO
To: ROHM CO., LTD.
Reel/Frame 010591/0318 →
Assignment of Assignor's Interest
Feb 10, 2000
From: HIKITA, JUNICHI; MOCHIDA, HIROO; SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 010560/0485 →
Assignment of Assignor's Interest
Feb 16, 2000
From: NAKAMURA, TOMOFUMI
To: ROHM CO., LTD.
Reel/Frame 010631/0867 →
Assignment of Assignor's Interest
Feb 23, 2000
From: SAMESHIMA, KATSUMI
To: ROHM CO., LTD.
Reel/Frame 010653/0199 →
Assignment of Assignor's Interest
Feb 29, 2000
From: NISHIMURA, ISAMU
To: ROHM CO., LTD.
Reel/Frame 010651/0216 →
Assignment of Assignor's Interest
Mar 7, 2000
From: SUENAGA, YOSHIAKI; KISHINO, TATSUO
To: ROHM CO., LTD.
Reel/Frame 010660/0913 →
Assignment of Assignor's Interest
Apr 11, 2000
From: MATSUMOTO, MUNEYUKI
To: ROHM CO., LTD.
Reel/Frame 010755/0968 →
Assignment of Assignor's Interest
May 15, 2000
From: HIKITA, JUNICHI; MOCHIDA, HIROO; NAKATANI, GORO; SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 010790/0238 →
Assignment of Assignor's Interest
May 15, 2000
From: HIKITA, JUNICHI; MOCHIDA, HIROO
To: ROHM CO., LTD.
Reel/Frame 010790/0498 →
Assignment of Assignor's Interest
May 30, 2000
From: HIKITA, JUNICHI; YAMAMOTO, KOJI; NISHIMURA, ISAMU; KUMAMOTO, NOBUHISA
To: KANSAI PAINT CO., LTD.
Reel/Frame 010851/0450 →
Assignment of Assignor's Interest
Jun 1, 2000
From: HIKITA, JUNICHI; MOCHIDA, HIROO
To: ROHM CO., LTD.
Reel/Frame 010820/0057 →
Assignment of Assignor's Interest
Jun 1, 2000
From: TAKIZAWA, NOBORU
To: ROHM CO., LTD.
Reel/Frame 010873/0895 →
Assignment of Assignor's Interest
Jun 6, 2000
From: HIKITA, JUNICHI; SAMESHIMA, KATSUMI
To: ROHM CO., LTD.
Reel/Frame 010830/0493 →
Assignment of Assignor's Interest
Jun 7, 2000
From: HIKITA, JUNICHI; NAKAGAWA, YOSHIKAZU; KUMAMOTO, NOBUHISA
To: ROHM CO., LTD.
Reel/Frame 010999/0642 →
Assignment of Assignor's Interest
Jun 19, 2000
From: SHIBATA, KAZUTAKA; HIKITA, JUNICHI; UEDA, SHIGEYUKI
To: ROHM CO., LTD.
Reel/Frame 010868/0832 →
Assignment of Assignor's Interest
Jun 19, 2000
From: HIKITA, JUNICHI; NISHIMURA, ISAMU; KUMAMOTO, NOBUHISA; MORISHIMA, YOSHIYASU
To: ROHM CO., LTD.
Reel/Frame 010866/0301 →
Assignment of Assignor's Interest
Jun 21, 2000
From: HIKITA, JUNICHI; SHIBATA, KAZUTAKA; UEDA, SHIGEYUKI
To: ROHM CO., LTD.
Reel/Frame 010870/0487 →
Assignment of Assignor's Interest
Jul 5, 2000
From: MOCHIDA, HIROO
To: ROHM CO., LTD.
Reel/Frame 010899/0171 →
Assignment of Assignor's Interest
Jul 11, 2000
From: HIKITA, JUNICHI; NAKATANI, GORO; KUMAMOTO, NOBUHISA; SAMESHIMA, KATSUMI
To: ROHM CO., LTD.
Reel/Frame 010913/0499 →
Corrective Assignment to Correct the Assignee's Name Filed 5/30/00 Recorded on Reel 10851 Frame 0450 Assignor Hereby Confirms the Assignment of the Entire Interest
Aug 24, 2000
From: HIKITA, JUNICHI; YAMAMOTO, KOJI; NISHIMURA, ISAMU; KUMAMOTO, NOBUHISA
To: ROHM CO., LTD.
Reel/Frame 010924/0785 →
Assignment of Assignor's Interest
Sep 20, 2000
From: UEDA, SHIGEYUKI
To: ROHM CO., LTD.
Reel/Frame 011158/0736 →
Assignment of Assignor's Interest
Oct 10, 2000
From: SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 011279/0358 →
Assignment of Assignor's Interest
Jun 17, 2020
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 052957/0699 →