Semiconductor device for radio communication device, and radio communication device using said semiconductor device
A chip-on-chip-structure semiconductor device for a radio communication device, having a base band chip and a high-frequency chip piled up on and bonded to the surface thereof. The base band chip has a low-frequency signal processing unit for processing a signal in a first frequency band. The high-frequency chip has a high-frequency signal processing unit for processing a signal in a second frequency band of which frequency is higher than that of the first frequency band.
1. A semiconductor device for a radio communication device in which a signal is received or transmitted a signal after frequency-conversion between frequency bands, the frequency bands including a first frequency band and a second frequency band that is higher in frequency than the first frequency band, wherein a semiconductor device for a radio communication device comprises:
a base band chip having a low-frequency signal processing unit for processing a signal in the first frequency band; and
a plurality of high-frequency chips piled up on and bonded to the surface of the base band chip, and having high-frequency signal processing units for processing a signal in the second frequency band, the high-frequency chips being electrically connected to the base band chip without any matching circuits interposed between the base band chip and the high-frequency chips,
wherein the high-frequency chips are disposed with the surfaces of the high-frequency chips opposite to the surface of the base band chip, and are connected to the base band chip by inter-chip connection members interposed between the opposite surfaces,
wherein the inter-chip connection members include metal projections on the surface of at least one of the base band chip and the high-frequency chips, the metal projections having a height that is smaller than the height of a bump,
wherein interconnections between the high-frequency chips are made via metal wiring on the surface of the base band chip, and
wherein the metal projections and the metal wiring are both formed of non-oxidizable metal films.
2. A semiconductor device for a radio communication device according to claim 1 , wherein the low-frequency signal processing unit includes a demodulator unit for demodulating a reception signal, and a signal processing unit for processing a signal demodulated by the demodulator unit.
3. A semiconductor device for a radio communication device according to claim 2 , wherein the high-frequency signal processing units include a transmitter unit for giving a transmission signal to an antenna, and a receiver unit for frequency-converting a reception signal from the antenna and giving the frequency-converted reception signal to the demodulator unit.
4. A semiconductor device for a radio communication device according to claim 3 , wherein the transmitter unit and the receiver unit are provided on different high-frequency chips.
5. A semiconductor device for a radio communication device according to claim 3 , wherein the receiver unit includes a filter for filtering a reception signal from the antenna.
6. A semiconductor device for a radio communication device according to claim 5 , wherein the filter is a surface acoustic wave filter.
7. A semiconductor device for a radio communication device according to claim 3 , wherein the high-frequency signal processing units include a switch unit which selects a transmission signal from the transmitter unit and provides the same to the antenna, or which selects a reception signal from the antenna and provides the same to the receiver unit.
8. A semiconductor device for a radio communication device according to claim 1 , wherein the base band chip and the high-frequency chips are made of respectively different types of semiconductor materials.
9. A semiconductor device for a radio communication device according to claim 1 , wherein the base band chip is made of a silicon semiconductor and the high-frequency chips are made of a compound semiconductor.
10. A radio communication device that includes (i) a semiconductor device for a radio communication device in which a signal is received or transmitted after frequency-conversion between the frequency bands, the frequency band including a first frequency band and a second frequency band that is higher in frequency than the first frequency band, and (ii) an antenna connected to the semiconductor device, wherein the semiconductor device comprises,
a base band chip having a low-frequency signal processing unit for processing a signal in the first frequency band; and
a plurality of high-frequency chips piled up on and bonded to a surface of the base band chip, and having a high-frequency signal processing units for processing a signal in the second frequency band, the high-frequency chips is being electrically connected to the base band chip without any matching circuits interposed between the high-frequency chips and the base band chip,
wherein the high-frequency chips are disposed with the surfaces of the high-frequency chips opposite to the surface of the base band chip, and are connected to the base band chip by inter-chip connection members interposed between the opposite surfaces,
wherein the inter-chip connection members include metal projections on the surface of at least one of the base band chip and the high-frequency chips, the metal projections having a height that is smaller than the height of a bump,
wherein interconnections between the high-frequency chips are made via metal wiring on the surface of the base band chip, and
wherein the metal projections and the metal wiring are both formed of non-oxidizable metal films.
11. A radio communication device according to claim 10 , wherein the low-frequency signal processing unit includes a demodulator unit for demodulating a reception signal, and a signal processing unit for processing a signal demodulated by the demodulator unit.
12. A radio communication device according to claim 11 , wherein the high-frequency signal processing units include a transmitter unit for giving a transmission signal to the antenna, and a receiver unit for frequency-converting a reception signal from the antenna and giving the frequency-converted reception signal to the demodulator unit.
13. A radio communication device according to claim 12 , wherein the receiver unit includes a filter for filtering a reception signal from the antenna.
14. A radio communication device according to claim 13 , wherein the filter is a surface acoustic wave filter.
15. A radio communication device according to claim 12 , wherein the high-frequency signal processing units include a switch unit which selects a transmission signal from the transmitter unit and provides the same to the antenna, or which selects a reception signal from the antenna and provides the same to the receiver unit.
16. A radio communication device according to claim 10 , wherein the base band chip and the high-frequency chip are made of respectively different types of semiconductor materials.