Patent Assignment
Reel/Frame 052957/0699
Assignment of Assignor's Interest
Recorded: 2020-06-17
Pages: 8
Assignor
ACHLYS TECHNOLOGIES INC.
Executed: 2020-02-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Properties
(43)
Semiconductor Device and Semiconductor Chip for Use Therein
Production of Semiconductor Device
Patent:
6,376,362 →
Application:
09/546,172 →
Semiconductor integrated circuit device with enhanced protection from electrostatic breakdown
Patent:
6,339,234 →
Application:
09/583,539 →
Semiconductor Chip with External Connecting Terminal
Patent:
6,870,248 →
Application:
09/588,628 →
Semiconductor Chip and Method of Producing the Same
Patent:
6,744,140 →
Application:
09/665,663 →
Semiconductor Device of Chip-on-Chip Structure with a Radiotion Noise Shield
Patent:
6,720,662 →
Application:
09/702,870 →
Method of Producing a Semiconductor Device by Dividing a Semiconductor Wafer into Separate Pieces of Semiconductor Chips
Patent:
6,635,512 →
Application:
09/704,563 →
Semiconductor Device with Warp Preventing Board Joined Thereto
Semiconductor Device and Method for Manufacturing the Same
Patent:
7,129,110 →
Application:
09/830,092 →
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device and Fabrication Process Therefor
Semiconductor Device with Chip-on-Chip Construction Joined via a Low-Melting Point Metal Layer
Semiconductor Chip and Semiconductor Device Using the Same, and Method of Fabricating Semiconductor Chip
Method of Cutting a Wafer into Individual Chips
Authentication System Having a Semiconductor Device Containing Data Which Are Difficult to Analyze Through Illegitimate Access, and Semiconductor Device Therefor
Semiconductor Device
Semiconductor Device and Method for Producing the Same
Semiconductor Device
Semiconductor Device and Fabrication Process Therefor
Electronic Device, Semiconductor Device Using Same, and Method for Manufacturing Semiconductor Device
Semiconductor Device and Semiconductor Chip for Use Therein
Method of Producing a Semiconductor Device by Dividing a Semiconductor Wafer into Separate Pieces of Semiconductor Chips
Method for Manufacturing Semiconductor Device
Semiconductor Device for Radio Communication Device, and Radio Communication Device Using Said Semiconductor Device
Semiconductor Device
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Chip and Method of Producing the Same
Semiconductor Device Manufactured with Auxillary Mask and Method for Producing the Same
Semiconductor Device with Multi-Staged Cut Side Surfaces
Semiconductor Chip with External Connecting Terminal
Semiconductor Chip with External Connecting Terminal
Semiconductor Chip with External Connecting Terminal
Semiconductor Device and Fabrication Process Therefor
Semiconductor Device and Method for Producing the Same
Semiconductor Device Having a Stacked Chip Structure
Semiconductor Chip and Semiconductor Device
Semiconductor Chip and Method for Manufacturing Same, Electrode Structure of Semiconductor Chip and Method for Forming Same, and Semiconductor Device
Semiconductor Chip, Method of Manufacturing Semiconductor Chip, and Semiconductor Device
Semiconductor Device
Semiconductor Chip, Electrode Structure Therefor and Method for Forming Same
Semiconductor Package, Printed Circuit Board Substrate and Semiconductor Device
Semiconductor Package, Printed Circuit Board Substrate and Semiconductor Device
Semiconductor Package, Printed Circuit Board Substrate and Semiconductor Device
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 11, 2000
From: MATSUMOTO, MUNEYUKI
To: ROHM CO., LTD.
Reel/Frame 010755/0968 →
Assignment of Assignor's Interest
May 15, 2000
From: HIKITA, JUNICHI; MOCHIDA, HIROO
To: ROHM CO., LTD.
Reel/Frame 010790/0498 →
Assignment of Assignor's Interest
Jun 1, 2000
From: TAKIZAWA, NOBORU
To: ROHM CO., LTD.
Reel/Frame 010873/0895 →
Assignment of Assignor's Interest
Sep 20, 2000
From: UEDA, SHIGEYUKI
To: ROHM CO., LTD.
Reel/Frame 011158/0736 →
Assignment of Assignor's Interest
Oct 10, 2000
From: SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 011279/0358 →
Assignment of Assignor's Interest
Nov 3, 2000
From: HIKITA, JUNICHI; YOSHIDA, IKUO; INO, KAZUHIDE
To: ROHM CO., LTD.
Reel/Frame 011303/0338 →
Assignment of Assignor's Interest
Mar 22, 2001
From: SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 011640/0454 →
Assignment of Assignor's Interest
Jun 27, 2001
From: SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 012163/0684 →
Assignment of Assignor's Interest
Nov 5, 2001
From: SHIBATA, KAZUTAKA; UEDA, SHIGEYUKI; ENAMI, TOSHIO
To: ROHM CO., LTD.
Reel/Frame 012311/0741 →
Assignment of Assignor's Interest
Mar 15, 2002
From: SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 012936/0474 →
Assignment of Assignor's Interest
Mar 22, 2002
From: SHIBATA, KAZUTAKA; OKA, JUNJI; KASUYA, YASUMASA
To: ROHM CO., LTD.
Reel/Frame 012722/0010 →
Assignment of Assignor's Interest
Jul 11, 2002
From: SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 013099/0797 →
Assignment of Assignor's Interest
Sep 18, 2002
From: NOSAKA, TAKESHI
To: ROHM CO., LTD.
Reel/Frame 013325/0894 →
Assignment of Assignor's Interest
Sep 27, 2002
From: SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 013341/0280 →
Assignment of Assignor's Interest
Oct 22, 2002
From: SHIBATA, KAZUTAKA
To: ROHM CO., LTD.
Reel/Frame 013413/0514 →
Assignment of Assignor's Interest
Dec 17, 2002
From: ANDO, SATOSHI
To: ROHM CO., LTD.
Reel/Frame 013588/0482 →
Assignment of Assignor's Interest
Mar 31, 2020
From: ROHM CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 052273/0877 →