Assignment of Assignor's Interest

Recorded: 2000-11-03 Pages: 3

Assignors

HIKITA, JUNICHI

Executed: 2000-10-26

YOSHIDA, IKUO

Executed: 2000-10-24

INO, KAZUHIDE

Executed: 2000-10-24

Assignee

ROHM CO., LTD.

21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO, JAPAN

Covered Property (1)

Method of Producing a Semiconductor Device by Dividing a Semiconductor Wafer into Separate Pieces of Semiconductor Chips

Patent: 6,635,512 →

Application: 09/704,563 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.