Patent Assignment
Reel/Frame 012936/0474
Assignment of Assignor's Interest
Recorded: 2002-03-15
Pages: 2
Assignor
SHIBATA, KAZUTAKA
Executed: 2002-02-27
Assignee
ROHM CO., LTD.
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI, JAPAN
Covered Property
(1)
Semiconductor Device with Chip-on-Chip Construction Joined via a Low-Melting Point Metal Layer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.