Semiconductor chip with external connecting terminal
A semiconductor device having a semiconductor chip and protective resin covering a sidewall of the semiconductor chip and having a surface formed so as to be flush with an inactive surface of the semiconductor chip. The semiconductor chip may be joined to a wiring board or another semiconductor chip. The semiconductor device may further include an external connecting terminal having an exposed portion exposed to the outside of the protective resin.
1. A semiconductor device, comprising:
a board having a mounting surface and an opposite surface; and
a semiconductor chip mounted on the mounting surface of the board, the semiconductor chip having an active surface and an inactive surface disposed opposite the active surface, the semiconductor chip being joined to the board in a state where the active surface thereof is facing to the board and the inactive surface thereof is exposed; the semiconductor chip having a thickness 100 μm to 200 μm; and
a protective resin permanently joined to the mounting surface of the board covering a sidewall of the semiconductor chip with the inactive surface thereof exposed to the outside of the protective resin, having a surface formed so as to be flush with an inactive surface of the semiconductor chip and having a side surface formed so as to be flush with a side surface of the board wherein the resin side surface and the chip side surface meet within a plane perpendicular to the mounting surface of the board.
2. The semiconductor device, according to claim 1 , further comprising:
an external connecting terminal permanently joined to an opposite surface of the board, the external connecting terminal being electrically connected to the active surface of the semiconductor chip.
3. The semiconductor device according to claim 1 , further comprising an interconnection terminal electrically connected to the active surface of the semiconductor chip, the interconnection terminal being joined to the active surface of the semiconductor chip and to the mounting surface of the board, the external terminal being electrically connected to the active surface of the semiconductor chip via the interconnection terminal.
4. The semiconductor device according to claim 1 , wherein the board is a wiring board having a wiring pattern formed therein.
5. The semiconductor device according to claim 1 , wherein the side surface of the resin and the side surface of the board form one plane.
6. The semiconductor device according to claim 5 , wherein the one plane coincides with the plane perpendicular to the mounting surface of the board.
7. A semiconductor device, comprising:
a board having a mounting surface and an opposite surface; and
a semiconductor chip mounted on the mounting surface of the board, the semiconductor chip having an active surface and an inactive surface disposed opposite the active surface, the semiconductor chip being joined to the board in a state where the active surface thereof is facing to the board and the inactive surface thereof is exposed; the semiconductor chip having a thickness 100 μm to 200 μm; and
a protective resin permanently joined to the mounting surface of the board covering a sidewall of the semiconductor chip with the inactive surface thereof exposed to the outside of the protective resin, having a surface formed so as to be flush with an inactive surface of the semiconductor chip.