Assignment of Assignor's Interest

Recorded: 2002-07-11 Pages: 3

Assignor

SHIBATA, KAZUTAKA

Executed: 2002-06-25

Assignee

ROHM CO., LTD.

21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI, JAPAN

Covered Property (1)

Method of Cutting a Wafer into Individual Chips

Patent: 6,818,550 →

Application: 10/192,655 →

Publication: US 2003/0013233

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.