IP Library › Assignment 011231/0132
Patent Assignment
Reel/Frame 011231/0132

Assignment of Assignor's Interest

Recorded: 2000-06-28 Pages: 6
Assignor
CRAY RESEARCH, L.L.C.
Executed: 2000-05-24
Assignee
TERA COMPUTER COMPANY
411 1ST AVENUE SOUTH, SEATTLE, WASHINGTON, 98104
Covered Properties (67)
Computer Vector Register Processing
Patent: 4,128,880 →
Application: 05/701,119 →
Cooling System for Electronic Assembly
Patent: 4,466,255 →
Application: 06/414,448 →
Immersion Cooled High Density Electronic Assembly
Patent: 4,590,538 →
Application: 06/442,569 →
Interconnected Multiple Circuit Module
Patent: 4,514,784 →
Application: 06/487,515 →
Circuit Module with Enhanced Heat Transfer and Distribution
Patent: 4,535,385 →
Application: 06/487,516 →
Solid State Storage Device
Patent: 4,630,230 →
Application: 06/488,114 →
Circuit Module with Enhanced Heat Transfer and Distribution
Patent: 4,628,407 →
Application: 06/599,688 →
Electrical Interface System
Patent: 4,771,378 →
Application: 06/622,066 →
Phase Modulated Pulse Logic for Gallium Arsenide
Patent: 4,638,188 →
Application: 06/644,249 →
Memory Reference Control in a Multiprocessor
Patent: 4,745,545 →
Application: 06/750,099 →
Personnel Antistatic Test Device
Patent: 4,800,374 →
Application: 06/925,283 →
Immersion Cooling Safety Monitoring System
Patent: 4,772,980 →
Application: 06/935,338 →
High Density Probe Head for Chip Testing
Patent: 663 →
Application: 07/143,511 →
High Density Disposable Printed Circuit Inter-Board Connector
Patent: 4,813,128 →
Application: 07/143,572 →
Integrated Circuit Test Socket
Patent: 4,962,356 →
Application: 07/234,818 →
Interconnected Multiple Circuit Module
Patent: 4,939,624 →
Application: 07/284,912 →
Cooling Plate with Interboard Connector Apertures for Circuit Board Assemblies
Patent: 4,884,168 →
Application: 07/284,992 →
Computer Look-Ahead Instruction Issue Control
Patent: 5,127,093 →
Application: 07/297,967 →
Memory Metal Electrical Connector
Patent: 5,098,305 →
Application: 07/324,906 →
Method of Making a Chip Carrier with Terminating Resistive Elements
Patent: 4,949,453 →
Application: 07/366,604 →
Nibble-Mode Dram Solid State Storage Device
Patent: 4,951,246 →
Application: 07/391,229 →
Bit Dispersement Method for Enhanced Sec-Ded Error Detection and Correction in Multi-Bit Memory Devices
Patent: 1,176 →
Application: 07/400,071 →
Board-Mounted Thermal Path Connector and Cold Plate
Patent: 5,014,904 →
Application: 07/464,909 →
Computer Signal Interconnect Apparatus
Patent: 5,123,848 →
Application: 07/556,024 →
Method for Software Simulation of a Hardware Design of a Cpu
Patent: 5,276,854 →
Application: 07/570,120 →
Z-Axis Pin Connectors for Stacked Printed Circuit Board Assemblies
Patent: 5,129,830 →
Application: 07/606,168 →
Z-Axis Pin Connectors for Stacked Printed Circuit Board Assemblies
Patent: 5,106,310 →
Application: 07/606,577 →
Method and Apparatus for Optimizing the Electrical Length of a Signal Flow Path
Patent: 5,162,743 →
Application: 07/611,899 →
High Density Interconnect Apparatus
Patent: 5,167,511 →
Application: 07/618,603 →
Disabled Memory Sections for Degraded Operation of a Vector Supercomputer
Patent: 5,327,550 →
Application: 07/618,685 →
Method and Apparatus for Producing Successive Calculated Results in a High-Speed Computer Functional Unit Using Low-Speed Vlsi Components
Patent: 5,151,995 →
Application: 07/622,325 →
Non-Metallized Chip Carrier
Patent: 1,153 →
Application: 07/646,834 →
Quick Disconnect System for Circuit Board Modules
Patent: 5,131,859 →
Application: 07/666,356 →
Z-Axis Connectors for Stacked Printed Circuit Board Assemblies
Patent: 5,152,696 →
Application: 07/679,653 →
Chip Carrier
Patent: 5,086,334 →
Application: 07/692,814 →
Shielded Connector Block
Patent: 5,178,549 →
Application: 07/722,110 →
Chip Carrier with Terminating Resistive Elements
Patent: 5,122,620 →
Application: 07/722,364 →
Apparatus for Ultrasonic Bonding
Patent: 5,180,093 →
Application: 07/755,067 →
Air Filtering Apparatus
Patent: 5,114,448 →
Application: 07/773,148 →
Method of Making a Chip Carrier with Terminating Resistive Elements
Patent: 34,395 →
Application: 07/804,958 →
Emitter Emitter Logic (Eel) and Emitter Collector Dotted Logic (Ecdl) Families
Patent: 5,182,473 →
Application: 07/826,214 →
Temperature Monitoring System for Air-Cooled Electric Components
Patent: 5,230,564 →
Application: 07/853,983 →
High Density Interconnect Apparatus
Patent: 5,211,565 →
Application: 07/854,312 →
Air Distribution System and Manifold for Cooling Electronic Components
Patent: 5,321,581 →
Application: 07/855,384 →
Method for Constructing a Reduced Capacitance Chip Carrier
Patent: 5,369,059 →
Application: 07/865,675 →
Ecl Latch with Single-Ended and Differential Inputs
Patent: 5,177,380 →
Application: 07/867,282 →
Laser Diode Package
Patent: 5,262,675 →
Application: 07/927,874 →
Method of Manufacturing Metal Connector Blocks
Patent: 5,224,918 →
Application: 07/963,813 →
Air Manifold for Cooling Electronic Components
Patent: 5,315,479 →
Application: 08/007,100 →
A Memory Interconnect Network Having Separate Routing Networks for Inputs and Outputs Using Switches with Fifo Queues and Message Steering Bits
Patent: 5,623,698 →
Application: 08/055,814 →
Method of Manufacturing Metallized Connector Block
Patent: 5,400,504 →
Application: 08/062,995 →
Pcb Tooling Apparatus and Method for Forming Patterns in Registration on Both Sides of a Substrate
Patent: 5,403,684 →
Application: 08/104,794 →
Automatic Interface for Cpu Real Machine and Logic Simulator Diagnostics
Patent: 5,438,673 →
Application: 08/113,724 →
Self-Aligned Sealing Fixture for Use in Assembly of Microelectronic Packages
Patent: 5,332,463 →
Application: 08/128,050 →
Bipolar Ecl to Inverted Cmos Level Translator
Patent: 5,424,658 →
Application: 08/165,156 →
Fiber Optic Channel Extender Interface Method and Apparatus
Patent: 5,420,583 →
Application: 08/250,375 →
Pcb Tooling Apparatus for Forming Patterns on Both Sides of a Substrate
Patent: 5,548,372 →
Application: 08/342,258 →
Vector Register Validity Indication to Handle Out-of-Order Element Arrival for a Vector Computer with Variable Memory Latency
Patent: 5,623,685 →
Application: 08/347,953 →
Computer Having Multiple Address Ports, Each Having Logical Address Translation with Based and Limit Memory Management
Patent: 6,012,135 →
Application: 08/347,964 →
Maintenance Channel for Modular, Highly Interconnected Computer Systems
Patent: 5,692,123 →
Application: 08/350,648 →
Apparatus and Method for Mounting Edge Connectors Within a Circuit Module
Patent: 5,726,857 →
Application: 08/605,356 →
Input/Output Module Assembly
Patent: 5,737,194 →
Application: 08/681,944 →
Virtual Memory System for Vector Based Computer Systems
Patent: 5,895,501 →
Application: 08/706,806 →
Apparatus and Method for Improved Vector Processing to Support Extended-Length Integer Arithmetic
Patent: 6,295,597 →
Application: 09/132,205 →
Register Scoreboarding to Support Overlapped Execution of Vector Memory Reference Instructions in a Vector Processor
Patent: 6,266,759 →
Application: 09/211,118 →
Digital Computing System Having Adaptive Communication Components
Patent: 6,496,544 →
Application: 09/211,221 →
Vector and Scalar Data Cache for a Vector Multiprocessor
Patent: 6,496,902 →
Application: 09/223,853 →
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Jun 14, 1994
From: CRAY COMPUTER CORPORATION
To: CONGRESS FINANCIAL CORPORATION
Reel/Frame 007023/0523 →
Assignment of Assignor's Interest Apr 5, 1999
From: CRAY COMPUTER CORPORATION
To: DASU LIMITED LIABILITY COMPANY
Reel/Frame 009866/0619 →
Change of Name May 10, 1999
From: DASU LIMITED LIABILITY COMPANY
To: MEDALLION TEHNOLOGY, LLC
Reel/Frame 009942/0058 →
Change of Name Apr 27, 2001
From: TERA COMPUTER COMPANY
To: CRAY, INC.
Reel/Frame 011712/0145 →
Security Interest May 9, 2001
From: CRAY, INC. (A WASHINGTON CORPORATION)
To: FOOTHILL CAPITAL CORPORATION (A CALIFORNIA CORPORATION)
Reel/Frame 011763/0716 →
Corrective Assignment to Correct the Name of the Assignee, Filed on 12-31-2001. Recorded on Reel 012322, Frame 0143. Assignor Hereby Confirms the (Assignment of Assignor's Interest) Dec 31, 2001
From: TERA COMPUTER COMPANY
To: CRAY INC.
Reel/Frame 012322/0143 →
Bankruptcy Court Order Apr 3, 2003
From: CRAY COMPUTER CORPORATION
To: DASU LIMITED LIABILITY CO.
Reel/Frame 013933/0285 →
Security Agreement Aug 24, 2005
From: CRAY INC.
To: WELLS FARGO BANK, N.A.
Reel/Frame 016446/0675 →