Patent Assignment
Reel/Frame 011265/0856
Assignment of Assignor's Interest
Recorded: 2000-10-24
Pages: 3
Assignor
TONG, QIN-YI
Executed: 2000-08-08
Assignee
RESEARCH TRIANGLE INSTITUTE
3040 CORNWALLIS ROAD, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709
Covered Property
(1)
Method of Epitaxial-Like Wafer Bonding at Low Temperature and Bonded Structure
Patent:
6,563,133 →
Application:
09/635,272 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 25, 2001
From: RESEARCH TRIANGLE INSTITUTE
To: ZIPTRONIX, INC.
Reel/Frame 012002/0970 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →