Patent Assignment
Reel/Frame 011283/0764
Assignment of Assignor's Interest
Recorded: 2000-10-31
Pages: 3
Assignors
TAKAHASHI, KOUICHI
Executed: 2000-06-01
KASAI, KENICHI
Executed: 2000-06-13
UDA, TAKAYUKI
Executed: 2000-06-13
NETSU, TOSHITADA
Executed: 2000-06-13
YAMAGUCHI, TAKESHI
Executed: 2000-06-13
MATSUSHITA, TAKAHIKO
Executed: 2000-06-13
MARUYAMA, OSAMU
Executed: 2000-06-13
DAIKOKU, TAKAHIRO
Executed: 2000-06-14
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI INFORMATION TECHNOLOGY CO., LTD.
456, SAKAI, NAKAI-MACHI, ASHIGARAKAMIGUN, KANAGAWA 259-0157, JAPAN
Covered Property
(1)
Sealing Structure for Multi-Chip Module
Patent:
7,518,233 →
Application:
09/590,897 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Nov 6, 2013
From: HITACHI INFORMATION TECHNOLOGY CO., LTD.
To: HITACHI INFORMATION & COMMUNICATION ENGINEERING, LTD.
Reel/Frame 031556/0020 →
Merger
Nov 7, 2013
From: HITACHI INFORMATION TECHNOLOGY CO., LTD.
To: HITACHI INFORMATION & TELECOMMUNICATION ENGINEERING, LTD.
Reel/Frame 031559/0159 →