IP Library › Assignment 031559/0159
Patent Assignment
Reel/Frame 031559/0159

Merger

Recorded: 2013-11-07 Pages: 26
Assignor
Assignee
HITACHI INFORMATION & TELECOMMUNICATION ENGINEERING, LTD.
2-3-3, MINATOMIRAI, NISHI-KU, KANAGAWA, YOKOHAMA-SHI, JAPAN
Covered Properties (2)
Sealing Structure for Multi-Chip Module
Patent: 7,518,233 →
Application: 09/590,897 →
Test Method of Semiconductor Intergrated Circuit and Test Pattern Generator
Patent: 6,922,803 →
Application: 09/811,435 →
Publication: US 2002/0073373
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 31, 2000
From: TAKAHASHI, KOUICHI; KASAI, KENICHI; UDA, TAKAYUKI; NETSU, TOSHITADA
To: HITACHI, LTD.; HITACHI INFORMATION TECHNOLOGY CO., LTD.
Reel/Frame 011283/0764 →
Assignment of Assignor's Interest Mar 20, 2001
From: NAKAO, MICHINOBU; HATAYAMA, KAZUMI; NATSUME, KOICHIRO; KIYOSHIGE, YOSHIKAZU
To: HITACHI, LTD.
Reel/Frame 011664/0426 →
Corrective Assignment to Add a Second Assignee, Previously Recorded at Reel 011664 Frame 0426. Oct 5, 2001
From: NAKAO, MICHINOBU; HATAYAMA, KAZUMI; NATSUME, KOICHIRO; KIYASHIGE, YOSHIKAZU
To: HITACHI, LTD.; HITACHI INFORMATION TECHNOLGY CO., LTD.
Reel/Frame 012229/0111 →
Corrective Assignment to Correct the Name of the Assignor That Was Previously Recorded on Reel 012229, Frame 0111. Apr 18, 2002
From: NAKAO, MICHINOBU; HATAYAMA, KAZUMI; NATSUME, KOICHIRO; KIYOSHIGE, YOSHIKAZU
To: HITACHI, LTD.; HITACHI INFORMATION TECHNOLOGY CO., LTD.
Reel/Frame 012807/0113 →
Merger Nov 6, 2013
From: HITACHI INFORMATION TECHNOLOGY CO., LTD.
To: HITACHI INFORMATION & COMMUNICATION ENGINEERING, LTD.
Reel/Frame 031556/0020 →