Assignment of Assignor's Interest

Recorded: 2000-11-10 Pages: 2

Assignor

LEE, JONG-MYOUNG

Executed: 2000-11-09

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Lead on Chip Type Semiconductor Package

Patent: 6,794,745 →

Application: 09/710,606 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.