Patent Assignment
Reel/Frame 011502/0191
Assignment of Assignor's Interest
Recorded: 2001-02-01
Pages: 5
Assignor
WU, PING
Executed: 2001-01-29
Assignee
MOBILINK TELECOM, INC.
3090 OAKMEAD VILLAGE DRIVE, SANTA CLARA, CALIFORNIA, 95051
Covered Property
(1)
Multi-Power Ring Chip Scale Package for System Level Integration
Patent:
6,770,963 →
Application:
09/754,900 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2001
From: WU, PING
To: MOBILINK TELECOM, INC.
Reel/Frame 011429/0276 →
Merger
Dec 8, 2002
From: MOBILINK TELECOM, INC.
To: BROADCOM CORPORATION
Reel/Frame 013563/0743 →
Patent Security Agreement
Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
Assignment of Assignor's Interest
Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
Termination and Release of Security Interest in Patents
Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
Merger
Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047196 Frame: 0097. Assignor(S) Hereby Confirms the Merger.
Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →