Patent Assignment
Reel/Frame 011585/0453
Assignment of Assignor's Interest
Recorded: 2000-11-16
Pages: 4
Assignor
AGA, FUMIAKI
Executed: 2000-11-07
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8, JAPAN
Covered Property
(1)
Epoxy Resin Composition and Semiconductor Device Using the Same
Patent:
6,358,629 →
Application:
09/713,010 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 2, 2009
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023594/0048 →
Change of Name
Oct 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTROINCS CORPORATION
Reel/Frame 025066/0884 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded on Reel 025066 Frame 0884. Assignor(S) Hereby Confirms the Assignee's Name Should Be Renesas Electronics Corporation.
Oct 5, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025084/0630 →