Patent Assignment
Reel/Frame 025084/0630
Corrective Assignment to Correct the Assignee's Name Previously Recorded on Reel 025066 Frame 0884. Assignor(S) Hereby Confirms the Assignee's Name Should Be Renesas Electronics Corporation.
Recorded: 2010-10-05
Pages: 14
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties
(4)
Semiconductor Package and Method of Producing the Package
Patent:
6,358,778 →
Application:
09/261,488 →
Epoxy Resin Composition and Semiconductor Device Using the Same
Patent:
6,358,629 →
Application:
09/713,010 →
Semiconductor Device
Semiconductor Device
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 3, 1999
From: SHINOHARA, TOSHIAKI
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 009818/0801 →
Assignment of Assignor's Interest
Nov 16, 2000
From: AGA, FUMIAKI
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 011585/0453 →
Assignment of Assignor's Interest
Jun 28, 2001
From: ABE, SHUNICHI; UEBAYASHI, TETSUYA; IZUMI, NAOKI; YAMAZAKI, AKIRA
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 011948/0733 →
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Assignment of Assignor's Interest
Dec 2, 2009
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023594/0048 →
Change of Name
Oct 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTROINCS CORPORATION
Reel/Frame 025066/0884 →