IP Library › Assignment 011660/0893
Patent Assignment
Reel/Frame 011660/0893

Assignment of Assignor's Interest

Recorded: 2001-04-02 Pages: 4
Assignors
ROHDE, HARTMUT
Executed: 2001-03-16
WENDLAND, GERHILD
Executed: 2001-03-22
Assignee
PAC TECH-PACKAGING TECHNOLOGIES GMBH
AM SCHLANGENHORST 15-17, D-14641, NAUEN, GERMANY
Covered Property (1)
Chip Carrier Device and Method for the Production of a Chip Carrier Device with an Electrical Test
Patent: 6,642,727 →
Application: 09/743,993 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2001
From: ROHDE, HARTMUT; WENDLAND, GERHILD
To: PAC TECH-PACKAGING TECHNOLOGIES GMBH; SMART PAC GMBH TECHNOLOGY
Reel/Frame 012231/0151 →
Merger Feb 21, 2018
From: SMART PAC GMBH TECHNOLOGY SERVICES
To: PAC TECH - PACKAGING TECHNOLOGIES GMBH
Reel/Frame 045400/0655 →