IP Library › Assignment 012231/0151
Patent Assignment
Reel/Frame 012231/0151

Assignment of Assignor's Interest

Recorded: 2001-07-11 Pages: 8
Assignors
ROHDE, HARTMUT
Executed: 2001-03-16
WENDLAND, GERHILD
Executed: 2001-03-22
Assignees
PAC TECH-PACKAGING TECHNOLOGIES GMBH
AM SCHLANGENHORST 15-17, D-14641, NAUEN, GERMANY
SMART PAC GMBH TECHNOLOGY
AM SCHLANGENHORST 17, D-14641, NAUEN, GERMANY
Covered Property (1)
Chip Carrier Device and Method for the Production of a Chip Carrier Device with an Electrical Test
Patent: 6,642,727 →
Application: 09/743,993 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 2, 2001
From: ROHDE, HARTMUT; WENDLAND, GERHILD
To: PAC TECH-PACKAGING TECHNOLOGIES GMBH
Reel/Frame 011660/0893 →
Merger Feb 21, 2018
From: SMART PAC GMBH TECHNOLOGY SERVICES
To: PAC TECH - PACKAGING TECHNOLOGIES GMBH
Reel/Frame 045400/0655 →