Patent Assignment
Reel/Frame 011737/0700
Assignment of Assignor's Interest
Recorded: 2001-04-24
Pages: 4
Assignors
IGUCHI, MANABU
Executed: 2001-04-19
MATSUBARA, YOSHIHISA
Executed: 2001-04-19
TAKEWAKI, TOSHIYUKI
Executed: 2001-04-19
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Formed with Metal Wiring on a Wafer by Chemical Mechanical Polishing, and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.