Patent Assignment
Reel/Frame 011784/0950
Mortgage
Recorded: 2001-05-01
Pages: 4
Assignors
CHIA, CHOK J.
Executed: 2001-04-25
LIM, SENG S.
Executed: 2001-04-25
LIEW, WEE K.
Executed: 2001-04-25
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BLVD. M/S D-106, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Molded Integrated Circuit Package
Patent:
6,525,421 →
Application:
09/846,080 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jul 27, 2010
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 024741/0411 →
Assignment of Assignor's Interest
Sep 8, 2010
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 024953/0593 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →