Patent Assignment
Reel/Frame 024953/0593
Assignment of Assignor's Interest
Recorded: 2010-09-08
Pages: 3
Assignor
LSI CORPORATION
Executed: 2010-08-18
Assignee
TESSERA INTELLECTUAL PROPERTIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(8)
Off-Axis Power Branches for Interior Bond Pad Arrangements
Patent:
5,384,487 →
Application:
08/058,120 →
Surface Mount Peripheral Leaded and Ball Grid Array Package
Patent:
5,563,446 →
Application:
08/187,238 →
Process for Manufacturing Off-Axis Power Branches for Interior Bond Pad Arrangements
Patent:
5,643,830 →
Application:
08/377,211 →
Method for Forming Interior Bond Pads Having Zig-Zag Linear Arrange- Ment
Patent:
5,567,655 →
Application:
08/469,086 →
Surface Mount Peripheral Leaded and Ball Grid Array Package
Patent:
5,789,811 →
Application:
08/725,735 →
Thin Power Tape Ball Grid Array Package
Patent:
5,869,889 →
Application:
08/840,614 →
Molded Integrated Circuit Package
Patent:
6,525,421 →
Application:
09/846,080 →
Ground Plane on 2 Layer Pbga
Patent:
6,687,133 →
Application:
10/295,711 →
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 5, 1993
From: ROSTOKER, MICHAEL D.; PASCH, NICHOLAS F.; ZELAYETA, JOE
To: LSI LOGIC CORPORATION
Reel/Frame 006541/0256 →
Assignment of Assignor's Interest
Jan 25, 1994
From: CHIA, CHOK J.; VARIOT, PATRICK
To: LSI LOGIC CORPORATION
Reel/Frame 006871/0386 →
Assignment of Assignor's Interest
Oct 4, 1996
From: CHIA, CHOK J.; VARIOT, PATRICK
To: LSI LOGIC CORPORATION
Reel/Frame 008277/0066 →
Assignment of Assignor's Interest
Apr 21, 1997
From: CHIA, CHOK J.; VARIOT, PATRICK; ALAGARATNAM, MARIAM
To: LSI LOGIC CORPORATION
Reel/Frame 008522/0980 →
Mortgage
May 1, 2001
From: CHIA, CHOK J.; LIM, SENG S.; LIEW, WEE K.
To: LSI LOGIC CORPORATION
Reel/Frame 011784/0950 →
Assignment of Assignor's Interest
Nov 15, 2002
From: LIEW, WEE K.; LIM, HONG T.; GUO, CHENGYU
To: LSI LOGIC CORPORATION
Reel/Frame 013507/0734 →
Change of Name
Jul 27, 2010
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 024741/0411 →
Change of Name
Aug 4, 2010
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 024785/0742 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Assignment of Assignor's Interest
Sep 20, 2011
From: ROSTOKER, MICHAEL D.; PASCH, NICHOLAS F.; ZELAYETA, JOE
To: LSI LOGIC CORPORATION
Reel/Frame 026978/0850 →
Assignment of Assignor's Interest
Sep 23, 2011
From: ROSTOKER, MICHAEL D.; PASCH, NICHOLAS F.; ZELAYETA, JOE
To: LSI LOGIC CORPORATION
Reel/Frame 026989/0886 →
Re-Record to Correct the Receiving Party, Previously Recorded at Reel 026978 Frame 0850.
Oct 10, 2011
From: ROSTOKER, MICHAEL D.; PASCH, NICHOLAS F.; ZELAYETA, JOE
To: LSI LOGIC CORPORATION
Reel/Frame 027053/0110 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →