IP Library › Assignment 011824/0470
Patent Assignment
Reel/Frame 011824/0470

Assignment of Assignor's Interest

Recorded: 2001-05-21 Pages: 3
Assignor
MILLER, CHARLES A.
Executed: 2001-05-09
Assignee
FORMFACTOR, INC.
5666 LA RIBERA STREET, LIVERMORE, CALIFORNIA, 94550
Covered Property (1)
Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via
Patent: 6,910,268 →
Application: 09/819,181 →
Publication: US 2002/0139577
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest in United States Patents and Trademarks Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
Security Interest Jul 29, 2025
From: FORMFACTOR, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 072263/0272 →
Release of Security Interest Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →