Assignment of Assignor's Interest

Recorded: 2001-06-12 Pages: 3

Assignor

BOLKEN, TODD O.

Executed: 2001-06-05

Assignee

MICRON TECHNOLOGY, INC.

8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707

Covered Property (1)

Two Stage Transfer Molding Method to Encapsulate Mmc Module

Patent: 6,444,501 →

Application: 09/879,171 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.