IP Library Granted Patent US 6,444,501
Granted Patent Utility
US 6,444,501 · Confirmation No. 3638

TWO STAGE TRANSFER MOLDING METHOD TO ENCAPSULATE MMC MODULE

Inventor: Todd O. Bolken
Patented Case View Patent ↗
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Code Description Pages PDF
2001-06-12 TRNA Transmittal of New Application 2 View
2001-06-12 SPEC Specification 18 View
2001-06-12 CLM Claims 14 View
2001-06-12 ABST Abstract 1 View
2001-06-12 DRW Drawings-only black and white line drawings 16 View
2001-06-12 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,444,501
App. No.
09/879,171
Filed
2001-06-12
Granted
2002-09-03
Art Unit
2827
PTA
-91 days