IP Library Granted Patent US 6,538,311
Granted Patent Utility
US 6,538,311 · Confirmation No. 1681

TWO-STAGE TRANSFER MOLDING METHOD TO ENCAPSULATE MMC MODULE

Inventor: Todd O. Bolken
⬇ PDF
Code Description Pages PDF
2002-03-05 TRNA Transmittal of New Application 2 View
2002-03-05 SPEC Specification 19 View
2002-03-05 CLM Claims 5 View
2002-03-05 ABST Abstract 1 View
2002-03-05 DRW Drawings-only black and white line drawings 16 View
2002-03-05 OATH Oath or Declaration filed 1 View
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Quick Facts
Patent No.
US 6,538,311
App. No.
10/092,216
Filed
2002-03-05
Granted
2003-03-25
Pub. No.
US20020187584A1
Art Unit
2827
PTA
-121 days