Patent Assignment
Reel/Frame 011917/0047
Assignment of Assignor's Interest
Recorded: 2001-06-19
Pages: 2
Assignor
HASEGAWA, EIJI
Executed: 2001-06-12
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of manufacturing semiconductor device having a plurality of gate insulating films of different thicknesses, and method of manufacturing such semiconductor device
Application:
09/883,373 →
Publication:
US 2001/0052618
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.