Patent Assignment
Reel/Frame 013620/0547
Assignment of Assignor's Interest
Recorded: 2003-05-01
Pages: 10
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Properties
(8)
Solid-State Image Pickup Device
Patent:
7,030,918 →
Application:
09/603,927 →
Semiconductor Device and Method of Manufacturing the Same
Patent:
6,559,542 →
Application:
09/615,328 →
Method and System for Estimating Plasma Damage to Semiconductor Device for Layout Design
Patent:
6,496,959 →
Application:
09/616,947 →
Anti-Reflection Structure for a Conductive Layer in a Semiconductor Device
Patent:
6,525,353 →
Application:
09/689,881 →
Method for Manufacturing a Semiconductor Device Having a Silicide Layer
Patent:
6,489,236 →
Application:
09/692,471 →
Sense Amplifier Circuit
Method of manufacturing semiconductor device having a plurality of gate insulating films of different thicknesses, and method of manufacturing such semiconductor device
Application:
09/883,373 →
Publication:
US 2001/0052618
Semiconductor Device with Reduced Number of Intermediate Level Interconnection Patterns
Application:
10/040,364 →
Publication:
US 2002/0056919
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 27, 2000
From: NAKASHIBA, YASUTAKA
To: NEC CORPORATION
Reel/Frame 010896/0984 →
Assignment of Assignor's Interest
Jul 12, 2000
From: ODA, NORIAKI
To: NEC CORPORATION
Reel/Frame 010952/0421 →
Assignment of Assignor's Interest
Jul 14, 2000
From: NOGUCHI, KO
To: NEC CORPORATION
Reel/Frame 010939/0491 →
Assignment of Assignor's Interest
Oct 13, 2000
From: IWASAKI, HARUO
To: NEC CORPORATION
Reel/Frame 011235/0424 →
Assignment of Assignor's Interest
Oct 13, 2000
From: NOGUCHI, KO
To: NEC CORPORATION
Reel/Frame 011226/0982 →
Assignment of Assignor's Interest
May 21, 2001
From: MATANO, TATSUYA
To: NEC CORPORATION
Reel/Frame 011835/0395 →
Assignment of Assignor's Interest
Jun 19, 2001
From: HASEGAWA, EIJI
To: NEC CORPORATION
Reel/Frame 011917/0047 →
Assignment of Assignor's Interest
Aug 15, 2002
From: ONO, ATSUKI; IMAI, KIYOTAKA
To: NEC CORPORATION
Reel/Frame 013152/0522 →
Assignment of Assignor's Interest
Mar 17, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013855/0914 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0959 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →