IP Library Assignment 012001/0741
Patent Assignment
Reel/Frame 012001/0741

Assignment of Assignor's Interest

Recorded: 2001-07-07 Pages: 2
Assignors
SAITOH, YOSHIKAZU
Executed: 2001-05-08
MORITA, SADAYUKI
Executed: 2001-05-08
SONODA, TAKAHIRO
Executed: 2001-05-08
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI ULSI SYSTEMS CO., LTD.
22-1, JOSUIHONCHO 5-CHOME, KODAIRA-SHI, TOKYO, JAPAN
Covered Property (1)
Semiconductor Wafer, Semiconductor Chip, and Manufacturing Method of Semiconductor Device
Patent: 6,711,075 →
Application: 09/906,060 →
Publication: US 2002/0009006
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014570/0380 →
Merger and Change of Name Sep 9, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024964/0180 →