Patent Assignment
Reel/Frame 012064/0510
Assignment of Assignor's Interest
Recorded: 2001-08-08
Pages: 2
Assignors
IIJIMA, SHINPEI
Executed: 2001-06-20
OHJI, YUZURU
Executed: 2001-06-20
KUNITOMO, MASATO
Executed: 2001-06-20
HIRATANI, MASAHIKO
Executed: 2001-06-28
MATSUI, YUICHI
Executed: 2001-06-28
OHTA, HIROYUKI
Executed: 2001-06-23
KUMAGAI, YUKIHIRO
Executed: 2001-06-23
Assignee
HITACHI, LTD.
CHIYODA-KU, 6, KANDA SURUGADAI 4-CHOME, TOKYO, JAPAN
Covered Property
(1)
Method of Forming a Capacitor in a Semiconductor Integrated Circuit Device Using a Metal Silicon Nitride Layer to Protect an Underlying Metal Silicide Layer from Oxidation During Subsequent Processing Steps
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2011
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026109/0528 →
Assignment of Assignor's Interest
May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →