Patent Assignment
Reel/Frame 012070/0671
Assignment of Assignor's Interest
Recorded: 2001-08-10
Pages: 3
Assignors
YAMAGATA, SHINICHI
Executed: 1997-07-14
IMAMURA, MAKOTO
Executed: 1997-07-14
TAKANO, YOSHISHIGE
Executed: 1997-07-14
HIROSE, YOSHIYUKI
Executed: 1997-07-14
ABE, YUGAKU
Executed: 1997-07-14
FUKUI, AKIRA
Executed: 1997-07-14
TAKIKAWA, TAKATOSHI
Executed: 1997-07-14
Assignee
SUMITOMO ELECTRIC INDUSTRIES, LTD.
CHUO-KU, OSAKA-SHI, 5-33, KITAHAMA 4-CHOME, OSAKA, JAPAN
Covered Property
(1)
Susbstrate Material for Mounting a Semiconductor Device, Substrate for Mounting a Semiconductor Device, Semiconductor Device, and Method of Producing the Same