Patent Assignment
Reel/Frame 012125/0886
Assignment of Assignor's Interest
Recorded: 2001-08-29
Pages: 3
Assignors
KADO, YOSHIYUKI
Executed: 2001-05-21
FUNANKI, TSUKIO
Executed: 2001-06-04
KIKUCHI, HIROSHI
Executed: 2001-06-29
YOSHIDA, IKUO
Executed: 2001-06-04
Assignees
HITACHI, LTD.
CHIYODA-KU, 6, KANDA SURUGADAI 4-CHOME, TOKYO, JAPAN
HITACHI HOKKAI SEMICONDUCTOR,LTD.
145,AZANAKAJIMA,NANAECHO,KAMEDA-GUN, 6, KANDA SURUGADAI 4-CHOME, HOKKAIDO, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 16, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014196/0875 →
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Merger and Change of Name
Mar 14, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.; RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042009/0428 →
Change of Name
Mar 14, 2017
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.
To: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 041574/0105 →
Assignment of Assignor's Interest
Mar 14, 2017
From: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 041574/0221 →
Change of Name
Mar 14, 2017
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042009/0384 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →