Patent Assignment
Reel/Frame 041574/0221
Assignment of Assignor's Interest
Recorded: 2017-03-14
Pages: 2
Assignor
RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Executed: 2017-03-07
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Properties
(2)
Method of Manufacturing a Semiconductor Device
Method of Manufacturing a Semiconductor Device
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 29, 2001
From: KADO, YOSHIYUKI; FUNANKI, TSUKIO; KIKUCHI, HIROSHI; YOSHIDA, IKUO
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR,LTD.
Reel/Frame 012125/0886 →
Assignment of Assignor's Interest
Dec 11, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014190/0106 →
Assignment of Assignor's Interest
Dec 16, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014196/0875 →
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Name
Mar 14, 2017
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.
To: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 041574/0105 →
Change of Name
Mar 14, 2017
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042009/0384 →
Merger and Change of Name
Mar 14, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.; RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042009/0428 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →