Patent Assignment
Reel/Frame 012128/0447
Assignment of Assignor's Interest
Recorded: 2001-08-23
Pages: 2
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
CHIYODA-KU, 2-3, MARUNOUCHI 2-CHOME, TOKYO 100-8310, JAPAN
Covered Property
(1)
Polishing Solution Supply System, Method of Supplying Polishing Solution, Apparatus for and Method of Polishing Semiconductor Substrate and Method of Manufacturing Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name
Sep 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0598 →