Patent Assignment
Reel/Frame 012205/0743
Assignment of Assignor's Interest
Recorded: 2001-09-21
Pages: 3
Assignors
CHEN, CHENG-KU
Executed: 2001-08-22
CHEN, FANG-CHENG
Executed: 2001-08-22
TAO, HUN-JAN
Executed: 2001-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
SCIENCE-BASED INDUSTRIAL PARK, 121 PARK AVE. 3, HSIN-CHU, R.O.C, TAIWAN
Covered Property
(1)
Silicon Shallow Trench Etching with Round Top Corner by Photoresist-Free Process
Patent:
6,500,727 →
Application:
09/957,423 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.