IP Library Assignment 012231/0461
Patent Assignment
Reel/Frame 012231/0461

Assignment of Assignor's Interest

Recorded: 2001-10-04 Pages: 3
Assignor
OUELLET, LUC
Executed: 2001-09-04
Assignee
ZARLINK SEMICONDUCTOR INC.
400 MARCH ROAD, KANATA, ON, K2K 3, CANADA
Covered Property (1)
Method of Aligning Structures on Opposite Sides of a Wafer
Patent: 6,555,441 →
Application: 09/923,367 →
Publication: US 2003/0032299
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 14, 2011
From: DALSA SEMICONDUCTOR INC.
To: TELEDYNE DALSA SEMICONDUCTOR INC.
Reel/Frame 027064/0622 →
Merger Feb 26, 2021
From: TELEDYNE DALSA SEMICONDUCTOR INC.
To: TELEDYNE DIGITAL IMAGING, INC.
Reel/Frame 055434/0643 →