IP Library Assignment 055434/0643
Patent Assignment
Reel/Frame 055434/0643

Merger

Recorded: 2021-02-26 Pages: 11
Assignor
TELEDYNE DALSA SEMICONDUCTOR INC.
Executed: 2021-01-01
Assignee
TELEDYNE DIGITAL IMAGING, INC.
1049 CAMINO DOS RIOS, THOUSAND OAKS, CALIFORNIA, 91360
Covered Properties (32)
Method of Depositing a Thick Dielectric Film
Patent: 6,598,610 →
Application: 09/775,465 →
Publication: US 2002/0106459
Method of Aligning a Photolithographic Mask to a Crystal Plane
Patent: 6,686,214 →
Application: 09/799,494 →
Publication: US 2002/0072193
Method of Inspecting an Anisotropic Etch in a Microstructure
Patent: 6,770,213 →
Application: 09/799,495 →
Publication: US 2002/0088769
Manufacture of Integrated Fluidic Devices
Patent: 6,602,791 →
Application: 09/842,836 →
Publication: US 2002/0160561
Method of Forming Spacers in Cmos Devices
Patent: 6,573,133 →
Application: 09/848,278 →
Publication: US 2002/0020884
Micro-Fluidic Devices
Patent: 6,825,127 →
Application: 09/910,795 →
Publication: US 2003/0022505
Method of Aligning Structures on Opposite Sides of a Wafer
Patent: 6,555,441 →
Application: 09/923,367 →
Publication: US 2003/0032299
Method of Making High-Voltage Bipolar/Cmos/Dmos (Bcd) Devices
Patent: 6,849,491 →
Application: 09/964,472 →
Publication: US 2003/0068844
Method of Making Specular Infrared Mirrors for Use in Optical Devices
Patent: 6,656,528 →
Application: 09/987,829 →
Publication: US 2003/0094433
Wafer-Level Mems Packaging
Patent: 6,635,509 →
Application: 10/120,528 →
Fabrication of Microstructures with Vacuum-Sealed Cavity
Patent: 6,902,656 →
Application: 10/153,593 →
Publication: US 2003/0217915
Fabrication of Mems Devices with Spin-on Glass
Patent: 6,896,821 →
Application: 10/226,189 →
Publication: US 2004/0035820
Wafer Level Packaging Technique for Microdevices
Patent: 7,138,293 →
Application: 10/310,814 →
Publication: US 2004/0067604
Compact High Voltage Esd Protection Diode
Patent: 6,972,462 →
Application: 10/426,450 →
Publication: US 2004/0070005
Method of Fabricating Silicon-Based Mems Devices
Patent: 7,144,750 →
Application: 10/459,619 →
Publication: US 2005/0233492
Method of Making Electrical Connections to Hermetically Sealed Mems Devices
Patent: 7,037,745 →
Application: 10/839,130 →
Publication: US 2005/0250238
Titanium Silicate Films with High Dielectric Constant
Patent: 7,101,754 →
Application: 10/864,472 →
Publication: US 2005/0277304
Hermetic Wafer-Level Packaging for Mems Devices with Low-Temperature Metallurgy
Patent: 7,291,513 →
Application: 11/004,973 →
Publication: US 2005/0142685
Method of Making High-Voltage Bipolar/Cmos/Dmos (Bcd) Devices
Patent: 7,341,905 →
Application: 11/020,217 →
Publication: US 2005/0136599
Fabrication of Mems Devices with Spin-on Glass
Patent: 7,579,622 →
Application: 11/054,946 →
Publication: US 2005/0145962
Fabrication of Advanced Silicon-Based Mems Devices
Patent: 7,160,752 →
Application: 11/242,960 →
Publication: US 2006/0166403
Method of Fabricating Silicon-Based Mems Devices
Patent: 7,459,329 →
Application: 11/254,774 →
Publication: US 2006/0110895
Anhydrous Hf Release of Process for Mems Devices
Patent: 7,365,016 →
Application: 11/314,535 →
Publication: US 2006/0211163
Method of Making Mems Wafers
Patent: 7,807,550 →
Application: 11/424,059 →
Publication: US 2007/0015341
Method for Removing Residues Formed During the Manufacture of Mems Devices
Patent: 8,071,486 →
Application: 11/457,911 →
Publication: US 2007/0134927
Method of Reducing Stress-Induced Mechanical Problems in Optical Components
Patent: 7,614,253 →
Application: 11/561,044 →
Publication: US 2007/0130996
Protection Capsule for Mems Devices
Patent: 7,682,860 →
Application: 11/687,287 →
Publication: US 2007/0231943
Method of Controlling Film Stress in Mems Devices
Patent: 7,799,376 →
Application: 11/829,646 →
Publication: US 2009/0029533
Microchannels for Biomems Devices
Patent: 7,799,656 →
Application: 12/045,853 →
Publication: US 2008/0299695
Method of Making Biomems Devices
Patent: 7,927,904 →
Application: 12/651,561 →
Publication: US 2010/0173436
Method of Making a Microfluidic Device
Patent: 8,975,193 →
Application: 13/196,421 →
Publication: US 2013/0034467
Calibration-Less Micro-Fabricated Vacuum Gauge Devices and Method for Measuring Pressure
Application: 16/001,363 →
Publication: US 2018/0364127
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 17, 2001
From: ROY, MARC; DAIGLE, MANON; LESSARD, BRUNO; COUTURE, GINETTE
To: MITEL CORPORATION
Reel/Frame 012082/0266 →
Assignment of Assignor's Interest Oct 4, 2001
From: OUELLET, LUC
To: ZARLINK SEMICONDUCTOR INC.
Reel/Frame 012231/0461 →
Assignment of Assignor's Interest Oct 12, 2001
From: OUELLET, LUC; TYLER, HEATHER
To: ZARLINK SEMICONDUCTOR INC.
Reel/Frame 012248/0008 →
Assignment of Assignor's Interest Oct 25, 2001
From: OUELLET, LUC; TYLER, HEATHER
To: MITEL CORPORATION
Reel/Frame 012282/0659 →
Assignment of Assignor's Interest Dec 13, 2001
From: MARTEL, STEPHANE; RIOPEL, YAN; MICHEL, SEBASTIEN; OUELLET, LUC
To: ZARLINK SEMICONDUCTOR, INC.
Reel/Frame 012367/0307 →
Change of Name Jul 9, 2003
From: ZARLINK SEMICONDUCTOR INC.
To: DALSA SEMICONDUCTOR INC.
Reel/Frame 014245/0869 →
Assignment of Assignor's Interest Aug 11, 2003
From: ORCHARD-WEBB, JONATHAN HARRY
To: ZARLINK SEMICONDUCTOR AB
Reel/Frame 014383/0129 →
Assignment of Assignor's Interest Sep 8, 2003
From: OUELLET, LUC; ANTAKI, ROBERT
To: DALSA SEMICONDUCTOR INC.
Reel/Frame 014466/0807 →
Assignment of Assignor's Interest Sep 1, 2004
From: OUELLET, LUC
To: DALSA SEMICONDUCTOR INC.
Reel/Frame 015752/0051 →
Assignment of Assignor's Interest Dec 1, 2004
From: MY ALI, EL KHAKANI; DILIP, SARKAR K.; OUELLET, LUC; BRASSARD, DANIEL
To: DALSA SEMICONDUCTOR INC.
Reel/Frame 016035/0138 →
Assignment of Assignor's Interest Jan 11, 2007
From: ZARLINK SEMICONDUCTOR AB
To: DALSA CORPORATION
Reel/Frame 018731/0947 →
Change of Name Aug 22, 2011
From: DALSA SEMICONDUCTOR INC.
To: TELEDYNE DALSA SEMICONDUCTOR INC.
Reel/Frame 026787/0404 →
Change of Name Oct 14, 2011
From: DALSA SEMICONDUCTOR INC.
To: TELEDYNE DALSA SEMICONDUCTOR INC.
Reel/Frame 027064/0622 →
Change of Name Mar 14, 2012
From: DALSA CORPORATION
To: TELEDYNE DALSA, INC.
Reel/Frame 027861/0614 →
Merger May 28, 2021
From: TELEDYNE DALSA, INC.
To: TELEDYNE DIGITAL IMAGING, INC.
Reel/Frame 056383/0939 →