Patent Assignment
Reel/Frame 027064/0622
Change of Name
Recorded: 2011-10-14
Pages: 5
Assignor
DALSA SEMICONDUCTOR INC.
Executed: 2011-02-14
Assignee
TELEDYNE DALSA SEMICONDUCTOR INC.
605 MCMURRAY ROAD, WATERLOO, ONTARIO, N2V 2E9, CANADA
Covered Properties
(50)
Spin-On Glass Processing Technique for the Fabrication of Semiconductor Devices
Patent:
5,320,983 →
Application:
07/930,615 →
Sog with Moisture Resistant Protective Capping Layer
Patent:
5,364,818 →
Application:
07/962,214 →
Moisture-Free Sog Process
Patent:
5,470,798 →
Application:
07/965,264 →
Multi-Level Interconnection Cmos Devices with Sog
Patent:
5,457,073 →
Application:
08/039,485 →
Preventing of via Poisoning by Glow Discharge Induced Desorption
Patent:
5,447,613 →
Application:
08/078,166 →
High Performance Passivation for Semiconductor Devices
Patent:
5,541,445 →
Application:
08/196,078 →
Method of Preparing Antimony Doped Semiconductor with Intrinsic Gettering
Patent:
5,587,325 →
Application:
08/313,091 →
Stabilization of the Interface Between Aluminum and Titanium Nitride
Patent:
5,747,361 →
Application:
08/543,497 →
Substrtae Processing Apparatus with Non-Evaporable Getter Pump
Patent:
5,935,395 →
Application:
08/666,256 →
Integrated Processing for an Etch Module Using a Hard Mask Technique
Patent:
6,074,946 →
Application:
08/794,441 →
Stabilization of the Interface Between Tin and A1 Alloys
Patent:
6,127,266 →
Application:
08/979,956 →
Method of Protecting Light Sensitive Regions of Integrated Circuits
Patent:
6,133,060 →
Application:
09/010,191 →
Method of Forming Capacitors on Integrated Circuit
Patent:
6,268,620 →
Application:
09/236,101 →
Method of Forming Capacitors in a Semiconductor Device
Patent:
6,083,805 →
Application:
09/314,105 →
Surface Stabilization of Silicon Rich Silica Glass Using Increased Post Deposition Delay
Patent:
6,372,671 →
Application:
09/652,796 →
Method of Depositing a Thick Dielectric Film
Method of Making a Functional Device with Deposited Layers Subject to High Temperature Anneal
Method of Inspecting an Anisotropic Etch in a Microstructure
Manufacture of Silica Waveguides with Minimal Absorption
Manufacture of Integrated Fluidic Devices
Method of Forming Spacers in Cmos Devices
Micro-Fluidic Devices
Method of Aligning Structures on Opposite Sides of a Wafer
Method of Depositing an Optical Quality Silica Film by Pecvd
Method of Making High-Voltage Bipolar/Cmos/Dmos (Bcd) Devices
Method of Making Specular Infrared Mirrors for Use in Optical Devices
Method of Preventing Cracking in Optical Quality Silica Layers
Method of Making Photonic Devices with Sog Interlayer
Wafer-Level Mems Packaging
Patent:
6,635,509 →
Application:
10/120,528 →
Fabrication of Microstructures with Vacuum-Sealed Cavity
Fabrication of Mems Devices with Spin-on Glass
Wafer Level Packaging Technique for Microdevices
A Method of Forming an Optical Sensor Device Having a Composite Sandwich Structure of Alternating Titanium Nitride Layers
Method of Fabricating Silicon-Based Mems Devices
Method of Making Electrical Connections to Hermetically Sealed Mems Devices
Titanium Silicate Films with High Dielectric Constant
Hermetic Wafer-Level Packaging for Mems Devices with Low-Temperature Metallurgy
Method of Making High-Voltage Bipolar/Cmos/Dmos (Bcd) Devices
Fabrication of Mems Devices with Spin-on Glass
Method of Making a Mems Device Containing a Cavity with Isotropic Etch Followed by Anisotropic Etch
Fabrication of Advanced Silicon-Based Mems Devices
Method of Fabricating Silicon-Based Mems Devices
Anhydrous Hf Release of Process for Mems Devices
Method of Making Mems Wafers
Method for Removing Residues Formed During the Manufacture of Mems Devices
Method of Reducing Stress-Induced Mechanical Problems in Optical Components
Protection Capsule for Mems Devices
Method of Controlling Film Stress in Mems Devices
Microchannels for Biomems Devices
Method of Making Biomems Devices
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 17, 2001
From: ROY, MARC; DAIGLE, MANON; LESSARD, BRUNO; COUTURE, GINETTE
To: MITEL CORPORATION
Reel/Frame 012082/0266 →
Assignment of Assignor's Interest
Oct 12, 2001
From: OUELLET, LUC; TYLER, HEATHER
To: ZARLINK SEMICONDUCTOR INC.
Reel/Frame 012248/0008 →
Assignment of Assignor's Interest
Oct 25, 2001
From: OUELLET, LUC; TYLER, HEATHER
To: MITEL CORPORATION
Reel/Frame 012282/0659 →
Merger
Feb 26, 2021
From: TELEDYNE DALSA SEMICONDUCTOR INC.
To: TELEDYNE DIGITAL IMAGING, INC.
Reel/Frame 055434/0643 →