Patent Assignment
Reel/Frame 012304/0369
Re-Record to Correct the Second Assignee's Address, Previously Recorded on Reel 012048 Frame 0876.
Recorded: 2001-11-13
Pages: 3
Assignors
TOBIMATSU, HIROSHI
Executed: 2001-05-09
KAMIURA, YUUKI
Executed: 2001-05-15
OKURA, SEIJI
Executed: 2001-05-15
SAWADA, MAHITO
Executed: 2001-05-15
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
CHIYODA-KU, 2-3, MARUNOUCHI 2-CHOME, TOKYO 100-8310, JAPAN
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
ITAMI-SHI, 1 MIZUHARA 4-CHOME, HYOGO 664-0005, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device Having Passivation Film and Buffer Coating Film
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 24, 2001
From: TOBIMATSU, HIROSHI; KAMIURA, YUUKI; OKURA, SEIJI; SAWADA, MAHITO
To: MITSUBISHI DENKI KABUSHIKI KAISHA; RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
Reel/Frame 012048/0876 →
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name
Sep 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0598 →