Assignment of Assignor's Interest

Recorded: 2001-12-05 Pages: 2

Assignor

BOWEN, NEAL M.

Executed: 2001-11-26

Assignee

MICRON TECHNOLOGY, INC.

8000 S. FEDERAL WAY, BOISE, IDAHO, 3706-

Covered Property (1)

Stacked Chip Connection Using Stand Off Stitch Bonding

Patent: 7,021,520 →

Application: 10/002,175 →

Publication: US 2003/0102358

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.