Patent Assignment
Reel/Frame 012372/0418
Assignment of Assignor's Interest
Recorded: 2001-12-05
Pages: 3
Assignors
HA, JONG EUN
Executed: 2001-11-29
KIM, TAEK CHEON
Executed: 2001-11-29
BAEK, JU YEOL
Executed: 2001-11-29
CHOI, JAE SEOK
Executed: 2001-11-29
CHOI, JANG SOO
Executed: 2001-11-29
Assignee
SAMSUNG CORNING CO., LTD.
472, SIN-DONG, PALDAL-GU, SUWON-SI, KYUNGKI-DO, 442-3, KOREA, REPUBLIC OF
Covered Property
(1)
On-Line Measuring System for Measuring Substrate Thickness and the Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Mar 10, 2008
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 020624/0240 →
Corrective Assignment to Correct the Assignee/Assignor Previously Recorded on Reel 020624 Frame 0240. Assignor(S) Hereby Confirms the Merger.
May 16, 2008
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 020956/0832 →
Change of Name
Aug 6, 2010
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 024804/0238 →