IP Library › Assignment 012516/0261
Patent Assignment
Reel/Frame 012516/0261

Assignment of Assignor's Interest

Recorded: 2002-01-18 Pages: 2
Assignor
HORIBE, HIROSHI
Executed: 2001-12-19
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property (1)
Semiconductor Device and Wire Bonding Apparatus
Patent: 6,787,927 →
Application: 10/050,166 →
Publication: US 2003/0042622
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name Sep 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0598 →