IP Library Assignment 012530/0686
Patent Assignment
Reel/Frame 012530/0686

Assignment of Assignor's Interest

Recorded: 2002-01-31 Pages: 2
Assignor
NIPPON STEEL CORPORATION
Executed: 2001-11-20
Assignee
UNITED MICROELECTRONICS CORPORATION
SCIENCE-BASED INDUSTRIAL PARK, NO. 3, LI HSIN RD II, HSIN-CHU CITY, 30077, R.O.C, TAIWAN
Covered Property (1)
Device for Supporting a Wafer
Patent: 5,192,087 →
Application: 07/769,432 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignors Interest. Nov 1, 1991
From: KAWASHIMA, HIDEAKI; EGUCHI, KOUHEI
To: NIPPON STEEL CORPORATION
Reel/Frame 005910/0067 →
Assignment of Assignor's Interest Jun 26, 2002
From: NIPPON STEEL CORPORATION
To: UNITED MICROELECTRONICS CORPORATION
Reel/Frame 013011/0300 →