Patent Assignment
Reel/Frame 012549/0614
Assignment of Assignor's Interest
Recorded: 2002-01-25
Pages: 4
Assignee
ESAB GROUP, INC., THE
POST OFFICE BOX 100545, FLORENCE, SOUTH CAROLINA, 29501
Covered Property
(1)
Electrode Component Thermal Bonding
Patent:
6,483,070 →
Application:
09/964,072 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Us Intellectual Property Security Agreement Supplement
May 17, 2012
From: ALCOTEC WIRE CORPORATION; ALLOY RODS GLOBAL, INC.; ANDERSON GROUP INC.; DISTRIBUTION MINING & EQUIPMENT COMPANY, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 028225/0020 →
Release of Security Interest
Jun 12, 2015
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: COLFAX CORPORATION; CONSTELLATION PUMPS CORPORATION; CLARUS FLUID INTELLIGENCE, LLC; ALCOTEC WIRE CORPORATION
Reel/Frame 035903/0051 →