IP Library › Assignment 012561/0414
Patent Assignment
Reel/Frame 012561/0414

Assignment of Assignor's Interest

Recorded: 2002-02-01 Pages: 3
Assignors
ZHOU, TIAO
Executed: 2002-02-01
HUNDT, MICHAEL J.
Executed: 2002-02-01
Assignee
STMICROELECTRONICS, INC.
1310 ELECTRONICS DRIVE, CARROLLTON, TEXAS, 75006
Covered Property (1)
Thermally-Enhanced Ball Grid Array Package Structure and Method
Patent: 7,180,175 →
Application: 10/061,507 →
Publication: US 2003/0146507
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 13, 2021
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 057791/0514 →
Assignment of Assignor's Interest Oct 25, 2021
From: STMICROELECTRONICS INTERNATIONAL N.V.
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 058298/0235 →